TECHNOLOGY

Product Simulation

Modern Design Validation

A computer-based process to virtually evaluate and validate product designs. It estimates and verifies critical properties like thermal and mechanical performance, enabling comparisons between design options.

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ADVANTAGE

Optimize Feasibility

Validate designs across all development stages.

Accelerate R&D

Speed up research and development processes.

Save Resources

Reduce time and costs on physical prototypes.

Key Insights from Product Simulation

Thermal Analysis:

  • Thermal resistance (°C/W).
  • Temperature distribution.




Fluid Dynamics:

  • P-Q curves for heat sinks,
  • radiators, fans, and pumps.




Mechanical Performance:

  • Deformation under load conditions.

What can we get from the product simulation?

  • Thermal properties
  • Thermal resistance (℃/W)
  • Temperature plot
  • Fluid dynamics properties
    a.Heat sink P-Q curve
    b.Radiator P-Q curve
    c.Fan P-Q curve
    d.Pump P-Q curve
  • Mechanical properties
Product deformation under specific spring loading

Component level

  • Air cooler: 1U, 2U, 3U, active, passive, heat pipes, VC, etc.
  • Liquid cooler: cold plate, radiator, fans

System level

  • Sever chassis
  • Sever cabinet
  • PC case

 

Information needed for the simulation

  1. Product 3D design files (3D CAD)
  2. Product materials specification
  3. Environment: ambient temperature, air flow rate
  4. Heater power and materials
  5. Fan & pump properties if needed
  6. Other specified information

A new simulation run is needed if any of the items above is changed.

 

Simulation time

  • 3D file pre-processing and simulation environment set up
Usually 0.5 hrs.~2.5 hrs., depends on the product

    complexity

Component level simulation
    Air cooler: Usually 10~30 mins for each run
    Liquid cooler: Usually 1~3 hrs. for each run

 

  • System level simulation
Usually 4hrs. ~ 1 day for each run

 

Simulation procedure

  1. Sales and engineers collect product requirement from the clients
  2. Perform the product simulation run according to the product requirement
  3. Send simulation results to client for reviewing
  4. Revise the product and run the simulation if there’s any feedback from client
  5. Physical sample prepare and test
    Revise the product and run the simulation based on the physical sample test (if needed)

Case example（An air cooler project）

  1. Client requirement: aim to beat a market model A
  2. Simulation tools used when performing
  3. 1. Thermal resistance simulation at the initial design stage

    2. Fin pitch/thickness optimization

    3. Fin tower size optimization

    4. Heat pipe position arrangement optimization
  4. Simulation results and physical sample test on the thermal resistance(℃/W)

Fan Technology

Core Features and Performance

Cooling fans maintain optimal temperatures for computer components by circulating air within or outside the case. They work in tandem with heat sinks and come in various styles and technologies to suit diverse cooling needs.

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GPU Fan Type

Open-Air Fans

Blower-Style Fans

Key Performance Indicators

1. Airflow (CFM):

  • Measures the air volume moved per minute (cubic feet per minute).
  • High airflow enhances cooling but may increase noise.




2. Fan Speed (RPM):

  • Measures rotations per minute.
  • Influenced by motor design, voltage, blade number, tilt angle, and bearings.
  • Higher RPM generally means better cooling performance.




3. Noise (dB):

  • Indicates fan operation loudness.
  • Measured under controlled conditions to ensure minimal and uniform sound.




4. Wind Pressure:

  • Balances pressure and volume for efficient cooling.
  • Higher wind pressure maintains airflow in high-resistance environments, such as dense heat sinks.

GPU Fan Type

  • Design Innovations


Blade adjustments, impeller shapes, and guide vanes to optimize efficiency.

  • Aesthetic Enhancements


LED lighting and custom styles.

  • Noise Optimization


Reducing disturbances while maintaining performance.

 

Dynatron focuses on precision engineering to deliver fans that excel in cooling capacity, durability, and energy efficiency.

Liquid Cooling

Efficient Heat Dissipation with Water

Liquid cooling systems use water circulation to efficiently transfer and dissipate heat, offering significant advantages over traditional air cooling. While fans remain essential for removing heat from the system, the integration of water provides superior heat transfer capabilities.

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Liquid Cooling Systems

Open System

Setup Complexity: 


Requires components like water blocks, tanks, pumps, and pipes.

Flexibility: 


Supports a wide range of applications beyond CPU cooling, such as GPUs and chipsets.

Performance:


Customizable tank sizes allow for higher heat dissipation and adaptability to demanding cooling needs.

Closed System (AIO Liquid Cooling)

Convenience: 


Combines cold head, pipes, and radiator into a single module for simplified installation.

Safety: 


Minimizes risks of assembly errors and leaks, ensuring reliable performance.

Dynatron Innovation:


Features advanced pumps and waterway designs to balance performance and noise for efficient cooling.

Key Technologies in Liquid Cooling

1.Water Circuit Design

  • Determines cooling efficiency by optimizing water flow speed and distribution.
  • Advanced designs ensure uniform heat dissipation across the radiator, maximizing performance.



2.Water Circuit Design

  • Drives water circulation with stable flow speed and pressure.
  • High-quality pumps are essential for maintaining consistent cooling and reducing operational noise.

Heat Pipe

Advanced Thermal Transfer Technology

Heat pipes are vital components in modern cooling systems, leveraging phase change and thermal conductivity to efficiently transfer heat from one area to another.

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Working Principle of a Heat Pipe

Heat Absorption

Heat is absorbed at the evaporator section, causing the working fluid inside the heat pipe to vaporize.

Heat Transfer

The vaporized fluid moves through the pipe to a cooler section, typically the condenser.

Heat Release

 At the condenser, the vapor releases its heat, condensing back into a liquid.

Fluid Return

The liquid returns to the evaporator via capillary action, gravity, or wick structures, repeating the cycle.

Key Technologies in Heat Pipe Design

1. Material Selection

  • High-Purity Metals: Materials like copper or aluminum enhance thermal conductivity and extend the lifespan of heat pipes.
  • Application-Specific Choices: Material selection depends on the heat transfer demands and operational environment.



2. Structural Design

  • Application-Specific Structures: Customized designs optimize heat transfer for different scenarios, such as compact electronics or large-scale systems.
  • Performance Optimization: Tailored structures ensure maximum efficiency in thermal transfer and cooling.



3. Surface Treatment

  • Corrosion Resistance: Coatings or treatments protect against environmental factors, enhancing durability.
  • Enhanced Heat Transfer: Surface modifications improve conductivity and performance.