As Intel continues to push the boundaries of server performance with its next-generation platforms — Diamond Rapids-AP and Granite Rapids-AP — thermal management becomes more critical than ever. Supporting TDPs as high as 660W, these new processors demand reliable, high-efficiency cooling solutions designed for the most demanding enterprise and data center environments.
Dynatron, a leading name in server thermal solutions for over 25 years, offers a line of air coolers engineered specifically for Intel LGA9324 and LGA7529 sockets. These solutions balance thermal efficiency, mechanical compatibility, and platform-specific optimization to support today’s high-density, high-performance workloads.
🧊 LGA9324 Air Cooling Solution: C21
For the Intel Diamond Rapids-AP platform, Dynatron presents the C21, a 2U air cooler built for extreme heat loads.
C21 – Key Specifications
| Attribute | Details |
|---|---|
| Socket Support | LGA9324 |
| CPU Compatibility | Intel® Diamond Rapids-AP |
| Form Factor | 2U Server |
| Maximum Power Dissipation | 660W @ 20°C Ambient |
| Dimensions | 156 x 107.5 x 64 mm |
| Material | 9 heatpipes, aluminum fin stack, aluminum + copper base |
| Thermal Grease | TBD |
| Screw Type / Torque | TBD |
The C21 is designed for maximum heat dissipation in dense server environments, making it a prime choice for data centers and HPC systems relying on 2U configurations.
🧊 LGA7529 Air Cooling Solutions: C1, C2, C3, C4
Intel’s Granite Rapids-AP platform — supported by the LGA7529 socket — demands scalable cooling across varying server form factors. Dynatron meets this demand with four specialized coolers for 1U, 2U, and 3U systems.
C3 – For High-Performance 3U Servers
Designed for larger server enclosures, the C3 delivers exceptional cooling for power-hungry applications.
| Attribute | Details |
|---|---|
| Socket | LGA7529 |
| CPU | Intel® Granite Rapids-AP |
| Form Factor | 3U and above |
| Max TDP | 570W |
| Dimensions | 140 x 97.8 x 107 mm |
| Fan | 80 x 80 x 38 mm, 2 Ball Bearing |
| Speed Range | 2400 – 8000 RPM |
| Airflow | Up to 115.61 CFM |
| Air Pressure | Up to 38.3 mm-H2O |
| Noise | Up to 64.4 dBA |
| Power Consumption | Up to 24.72W |
| Lifespan | 70,000 hours @ 40°C |
With direct heat pipe contact and high airflow, the C3 excels in mission-critical workloads with intense thermal demands.
C4 – Ultra-Low-Profile Cooling for 1U Systems
| Attribute | Details |
|---|---|
| Socket | LGA7529 |
| CPU | Intel® Granite Rapids-AP |
| Form Factor | 1U |
| Max TDP | 400W |
| Dimensions | 126.8 x 97.8 x 26.8 mm |
| Weight | 450 g |
| Material | Copper fins + vapor chamber |
| Thermal Grease | Shin-Etsu X23-8079-2 |
The C4 is ideal for compact server deployments where space and airflow are limited but cooling performance cannot be compromised.
C2 – Balanced 2U Cooling for Versatile Applications
| Attribute | Details |
|---|---|
| Socket | LGA7529 |
| CPU | Intel® Granite Rapids |
| Form Factor | 2U and above |
| Max TDP | 400W |
| Dimensions | 132.5 x 97.8 x 67 mm |
| Fan | 60 x 60 x 25 mm |
| Speed Range | 2300 – 11000 RPM |
| Airflow | Up to 58.31 CFM |
| Air Pressure | Up to 28.8 mm-H2O |
| Noise | Up to 59.8 dBA |
| Power | Up to 18W |
| Lifespan | 70,000 hours @ 40°C |
Built with aluminum stacked fins and direct-contact heat pipes, the C2 is a well-rounded solution for enterprise-grade 2U servers.
C1 – Optimized for Mid-Tier Thermal Demands
| Attribute | Details |
|---|---|
| Socket | LGA7529 |
| Form Factor | 2U and Up |
| Max TDP | 450W |
| Dimensions | 126.8 x 97.8 x 64 mm |
| Weight | 650 g |
| Material | Aluminum fin with heat pipe |
| Thermal Grease | Shin-Etsu X23-8079-2 Pre-Printed |
The C1 offers a slightly more compact alternative for customers seeking high reliability and clean installation in mid-height systems.
🔧 Why Choose Dynatron for Intel LGA Server Cooling?
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✅ Platform-Specific Optimization
Our solutions are designed and tested specifically for Intel’s LGA9324 and LGA7529 sockets, ensuring performance and compatibility. -
✅ Proven Engineering
With 25+ years of experience in thermal design, Dynatron is the trusted partner for OEM/ODM customers across the globe. -
✅ Custom Development Support
Need customizations? Our engineering team can provide thermal tuning and form factor adaptation for your unique server design.
📞 Get in Touch
Looking for the right cooler for your next-generation Intel server platform?
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